Monday, December 8, 2014

Status of prototype build.

We are now in the Portland OR area and could fetch mail (and boxes) from our mail drop.   Most all the components have arrived, and the PCB should be here soon.   But there is one delay:  the inductors from CoilCraft are on back-order until the end of January... 

Oh Well, will give me time to play with other parts of the bringup.


Friday, November 21, 2014

v0.0.1a of hardware design released

Today I edited this BLOG to put in the resource links above, and also posted the final release hardware design for the initial build v0.0.1a:


See 'Schematic' link above for larger image .pdf file


And here are some 3D renderings:


Top view


 
Bottom view


The module is approx 3x4" (actually, 80mm x 100mm), utilized 100v FETs and caps (I am suggesting keeping solar panel voltage below 85v), and can support up to 25A battery current.  These give it the following range of charging support per module:
  • 12v battery:         345W capacity
  • 24v battery:         690W
  • 32/36v battery: 1,000W
  • 48v battery:      1,380W
 To each the above capacities one or more solar panel can be used.  Example, for a 12v system one could use a single large 280W panel per controller.  For a 48v system, 4 such panels could be deployed in a combination of serial/parallel connection.

The costed BOM come to $73.30 + price of PCBs, which could be found for under $10 using overseas supplier.  I expect parts to arrive some time in December and will start assembling one unit then, and when I return to Viking Star will be able to start playing with trial runs on our solar panels as well as start developing the more advanced firmware.


For those interested there is a LTSPICE model of the buck converter using in this design under the CAD resource tab above - kind of fun to play with.




Saturday, November 8, 2014

Final 'Rough-Cut' schematics #3

Tonight I posted what I am calling the last of the 'Rough Cut' schematics; last as I have completed my initial review of the switchers - and am well underway in PCB layout.  Next step will be to release v0.1 of the design, along with the CAD files.

Over the past weeks or so I have been focusing on the FETs and doing a bit of SPICE modeling, paying attention to the transitions.  As a result I swapped out the FET driver ICs for ones that are able to drive the FETs harder, removed any imposed gate resistance, and also removed the bypass diodes around the lower FETs.  This last step might seem odd, but in refining things I have been able to greatly shorten the dead-time, currently looking at using 35nS as a very safe starting point.  This short time seems contrary to some folks thinking for such large FETs, but actually is in line with start-of-the-art designs - Drive the FETs Fast-n-hard, and with the right drivers (ala the LT's I am now specifying) am able to get real tight switching w/o any adverse effects.


A higher resolution PDF file:


 
Some other small changes include:

  • Finalization of 5V and 13V power supplies. (though may need to change out 10Ohm R3, am just trying to reduce the number of different parts used)
  • Addition of 'Service Port' which can be used instead of populating USB
  • Upgrading all FETs to 100v parts, allows use of two common panels in series for 24v/48v batteries.
  • Reduced some of the large switching  CAPs, still have plenty for the design.
  • Changed Amp Shunt resisters from 1mOhm to 2mOhm for better use of ADC ranges

With these changes, the .xls sheet is indicating 98.6% - 98.7% conversion in the core.  SPICE modeling seems to confirm this, will see with actual hardware.


I have also been revising the layout of the core switching elements to minimize current paths.  I still have some work to do, and may end up modifying the schematic some, but largely I think this is close to what the finial design will be.



Note how some parts are still not places, I need to work on the drivers a bit more - but overall am happy with how this layout is shaping up.

We are about to begin our move from Minnesota back to Washington (and Viking Star) - with a stop in Portland for the Holidays.  It is likely I will not have too much time to put into this over the next few weeks, hence I wanted to get what I had posted.   But I do intend to finish this in time to order up some PCBs and parts so I can start playing with hardware after the new year, and when I am back at the boat with the solar panels!



Sunday, October 26, 2014

Rought Draft #2 of schematic, and a draft PCB layout

I have posted into the Schematic link above a .pdf of the latest schematic.  Not a whole bunch has changed from the 1st rough-cut, Refining the FETs - settled on an asymmetrical pair:  Faster switching top FET, and lower Rdon lower FET.  Also have gone with DPAK devices for this 1st PCB FAB, may upgrade to the better PQFP ones later, but the DPAK ones will be simpler to replace if need be :-)    Replaced the LDO with a 2nd switcher in the power supply sub-system, saving that 125mW overhead.  And did a little SPICE modeling on the FETs and drivers and hence added a spot for some additional gate drive options (specifically the fast pull-down diodes on the High FETs) that might help with some of the cross-over losses.

Click for larger view <BR/> Also see the .pdf under the Schematics link above.


And here are a couple of views of the PCB layout Top and bottom:

Top view



The PCB comes in at 10x7cm, and a rough BOM cost of around $75-80, including an off-shore PCB fab.  I tried to select higher temperature 125c rated parts; that did increased BOM cost perhaps 10%.  If one wanted to back off and use an external USB <--> TTL adapter, and drop the CAN ports, might save $15-20???  Dropping one bank might save another $10??  (The PCBs come in around $2-3 using off-shore fab, so not sure it is worth doing more than one PCB design - just do stuffing options)

In the top 3D rendering above you can see some odd parts, notably the USB connector.  This is the result of stuffing options in the PCB design - I have in there the ability to use horizontal or vertical components for the USB, DIP switch, and the RJ-45 ports.  Or, one can populate headers and use external cables (e.g., to place this into a waterproof box and use waterproof external connectors vs. wiring glands).  Because all the stuffing options are in the schematic, they are rendered in the 3D view - each on top of the others.


Still to do:  I need to go through and confirm all the switching power supply calculations, inductors, caps, etc. (and there are three of them on the board!)  The caps used on the solar buck are rather costly (around $2-3 each), and want to make sure I have in what is both needed, but not more than what is.  I also need to finish the PCB layout, just a couple more routs to do, and confirm some thermal dissipation around the FETs - as I am relying on the PCBs as the heat-sinks.  Look for a physical interference between the caps and the large solar and battery connectors - the 3D rendering shows an overlap, but the connector 3D modes are mocked up and may not be accurate.  And I want to put some time into the xxM1 uCs and Arduino IDE - there are a few postings out there about using the uC with the Arduino IDE, want to make sure it will actually work before getting much further along.

There is a lot going on family wise these days, the above may take me a bit of time to complete.  My intention is once I complete some of the tasks above to order a set of 3x OSH-PARK PCBs and a set of components to build one up.  If someone is interested in building up one of the other PCBs, drop me a line.  At that time will also post up the CAD files to the links above.   I figure once things are proven a bit, will revise the PCB and get a set of them made - perhaps look into have some of the SMT parts machine assembled.  Might also revise the FETs to the 'better', but harder to hand assemble, QPFP packages.








Monday, October 13, 2014

Fine tuning the FETs



Have done some more modeling and think I am about at the end of incremental improvements using this tool.  I posted the .xls sheet with the additional drivers, FETs, and inductors I have been using in the reference tab above.

Below as the detailed results for three potential FETs.  All SMT, one the new PQFP package and two DPAK ones.  Costs are 1x qty from Mouser.com  Parameters use for each run was:

                Vpanel = 32.0v
                Vbat      = 13.8v
                22uF inductor
                100Khz PWM frequency

Early on I had to look to increase the operating frequency from 50Khz to 100Khz else the output capacity ESR losses became very large.  Unfortunately, increasing the frequency also increased switching losses in the FETs…  And at this point the switching losses for the high side FET are in the 350mW range.   Here are the detailed tables:



1)  IRFH7185 – PQFP - $3.92

IOUT (A)
HS Conduction Losses
LS Conduction Losses
HS Switching Losses
Diode Conduction Losses
Reverse Recovery Losses
MOSFET Output Capacitance Losses
High Side Gate Drive Losses
Low Side Gate Drive Losses
Inductor Winding Losses
Output Power (W)
Input Power (W)
Efficiency
HS Die Temperature (˚C)
LS Die Temperature (˚C)
.00
.0021
.0025
.0000
.0000
.3520
.1096
.0360
.0360
.0000
.00
.5382
0.00%
41.23
25.09
1.00
.0042
.0049
.0386
.0032
.3520
.1096
.0360
.0360
.0029
13.80
14.3873
95.92%
42.65
25.28
2.00
.0104
.0121
.0771
.0064
.3520
.1096
.0360
.0360
.0114
27.60
28.2511
97.70%
44.22
25.65
3.00
.0209
.0242
.1157
.0096
.3520
.1096
.0360
.0360
.0257
41.40
42.1297
98.27%
45.94
26.18
4.00
.0358
.0413
.1543
.0128
.3520
.1096
.0360
.0360
.0458
55.20
56.0235
98.53%
47.81
26.89
5.00
.0554
.0635
.1929
.0160
.3520
.1096
.0360
.0360
.0715
69.00
69.9328
98.67%
49.84
27.78
6.00
.0798
.0909
.2314
.0192
.3520
.1096
.0360
.0360
.1030
82.80
83.8579
98.74%
52.05
28.85
7.00
.1093
.1239
.2700
.0224
.3520
.1096
.0360
.0360
.1401
96.60
97.7993
98.77%
54.43
30.12
8.00
.1442
.1626
.3086
.0256
.3520
.1096
.0360
.0360
.1830
110.40
111.7576
98.79%
57.00
31.59
9.00
.1848
.2073
.3471
.0288
.3520
.1096
.0360
.0360
.2317
124.20
125.7333
98.78%
59.77
33.26
10.00
.2314
.2585
.3857
.0320
.3520
.1096
.0360
.0360
.2860
138.00
139.7272
98.76%
62.75
35.17
11.00
.2845
.3167
.4243
.0352
.3520
.1096
.0360
.0360
.3461
151.80
153.7403
98.74%
65.96
37.32
12.00
.3444
.3822
.4629
.0384
.3520
.1096
.0360
.0360
.4118
165.60
167.7733
98.70%
69.41
39.72
13.00
.4117
.4557
.5014
.0416
.3520
.1096
.0360
.0360
.4833
179.40
181.8273
98.67%
73.12
42.40







2)  IPD096N08N3 – DPAK - $1.78

IOUT (A)
HS Conduction Losses
LS Conduction Losses
HS Switching Losses
Diode Conduction Losses
Reverse Recovery Losses
MOSFET Output Capacitance Losses
High Side Gate Drive Losses
Low Side Gate Drive Losses
Inductor Winding Losses
Output Power (W)
Input Power (W)
Efficiency
HS Die Temperature (˚C)
LS Die Temperature (˚C)
.00
.0054
.0063
.0000
.0000
.2912
.0502
.0260
.0260
.0000
.00
.4051
0.00%
42.34
25.32
1.00
.0106
.0124
.0321
.0040
.2912
.0502
.0260
.0260
.0029
13.80
14.2553
96.81%
44.20
25.82
2.00
.0264
.0306
.0641
.0080
.2912
.0502
.0260
.0260
.0114
27.60
28.1339
98.10%
46.59
26.93
3.00
.0533
.0616
.0962
.0120
.2912
.0502
.0260
.0260
.0257
41.40
42.0423
98.47%
49.55
28.68
4.00
.0923
.1062
.1283
.0160
.2912
.0502
.0260
.0260
.0458
55.20
55.9820
98.60%
53.10
31.11
5.00
.1445
.1656
.1604
.0200
.2912
.0502
.0260
.0260
.0715
69.00
69.9553
98.63%
57.31
34.28
6.00
.2113
.2418
.1924
.0240
.2912
.0502
.0260
.0260
.1030
82.80
83.9658
98.61%
62.25
38.29
7.00
.2944
.3368
.2245
.0280
.2912
.0502
.0260
.0260
.1401
96.60
98.0173
98.55%
68.02
43.24
8.00
.3963
.4542
.2566
.0320
.2912
.0502
.0260
.0260
.1830
110.40
112.1155
98.47%
74.71
49.31
9.00
.5201
.5980
.2886
.0360
.2912
.0502
.0260
.0260
.2317
124.20
126.2678
98.36%
82.51
56.70
10.00
.6693
.7740
.3207
.0400
.2912
.0502
.0260
.0260
.2860
138.00
140.4834
98.23%
91.57
65.70
11.00
.8488
.9910
.3528
.0440
.2912
.0502
.0260
.0260
.3461
151.80
154.7760
98.08%
102.15
76.75
12.00
1.0658
1.2600
.3848
.0480
.2912
.0502
.0260
.0260
.4118
165.60
169.1639
97.89%
114.60
90.40
13.00
1.3280
1.5970
.4169
.0520
.2912
.0502
.0260
.0260
.4833
179.40
183.6706
97.67%
129.31
107.45





3) IPB090N06N3 – DPAK - $1.73,  60V max part
IOUT (A)
HS Conduction Losses
LS Conduction Losses
HS Switching Losses
Diode Conduction Losses
Reverse Recovery Losses
MOSFET Output Capacitance Losses
High Side Gate Drive Losses
Low Side Gate Drive Losses
Inductor Winding Losses
Output Power (W)
Input Power (W)
Efficiency
HS Die Temperature (˚C)
LS Die Temperature (˚C)
.00
.0037
.0046
.0000
.0000
.1280
.0655
.0360
.0360
.0000
.00
.2739
0.00%
32.89
25.19
1.00
.0072
.0091
.0302
.0040
.1280
.0655
.0360
.0360
.0029
13.80
14.1188
97.74%
34.24
25.52
2.00
.0178
.0223
.0603
.0080
.1280
.0655
.0360
.0360
.0114
27.60
27.9855
98.62%
35.87
26.21
3.00
.0358
.0446
.0905
.0120
.1280
.0655
.0360
.0360
.0257
41.40
41.8742
98.87%
37.79
27.26
4.00
.0614
.0763
.1207
.0160
.1280
.0655
.0360
.0360
.0458
55.20
55.7856
98.95%
40.03
28.69
5.00
.0950
.1176
.1509
.0200
.1280
.0655
.0360
.0360
.0715
69.00
69.7206
98.97%
42.58
30.51
6.00
.1371
.1693
.1810
.0240
.1280
.0655
.0360
.0360
.1030
82.80
83.6799
98.95%
45.47
32.73
7.00
.1882
.2319
.2112
.0280
.1280
.0655
.0360
.0360
.1401
96.60
97.6650
98.91%
48.72
35.40
8.00
.2490
.3065
.2414
.0320
.1280
.0655
.0360
.0360
.1830
110.40
111.6775
98.86%
52.36
38.54
9.00
.3203
.3939
.2715
.0360
.1280
.0655
.0360
.0360
.2317
124.20
125.7189
98.79%
56.41
42.19
10.00
.4029
.4955
.3017
.0400
.1280
.0655
.0360
.0360
.2860
138.00
139.7916
98.72%
60.93
46.42
11.00
.4979
.6129
.3319
.0440
.1280
.0655
.0360
.0360
.3461
151.80
153.8983
98.64%
65.93
51.27
12.00
.6066
.7482
.3621
.0480
.1280
.0655
.0360
.0360
.4118
165.60
168.0423
98.55%
71.49
56.85
13.00
.7307
.9036
.3922
.0520
.1280
.0655
.0360
.0360
.4833
179.40
182.2275
98.45%
77.66
63.23





System overhead:
         o    Output capacitor losses – est:   26mW (using 3.57A inductor ripple current)
         o    Input capacitor losses    - est:  162mW using 9A load.
·                O       +5v rail:  25mA -->   125mW
o   uC consumption:       14mA @5v (per datasheet typical)
o   OpAmps:                     100uA @ 5v (per datasheet typical)
o   CAN consumption:     6mA @ 5v (assuming a 1% dominate/recessive ratio)
o   Various pull-ups:         5mA @ 5v (WAG)
·    ·           O       uC power supply loss:  134mW
o   Switcher loss:                    9mW (Per datasheet, 25mA load, 36v Vin)
o   Linear Loss:                   125mW  (10v à 5v = 5v drop at 25mA)  -- Clearly need to look at this closer…
·    ·           O       Vbat & Vpan resistor network:  1.2mW
o   Vbat:                     190uW
o   Vpanel:                1mW

Total estimated overhead:  26mW + 162 + 125mW + 134mW + 1.2mW =   449mW  --> 450mW

Based on 250w input this would be a 0.18% reduction in the above efficiency numbers.  So, the IRFH7185 selection, instead of being 98.78% efficiency would come in at 98.60% overall.
If one did a depopulated (one bank only) configuration, and eliminated the CAN subsystem – that would save 60mW in losses between the CAN transceiver and uC power supplies.


The straw-man has a liner LDO regulator taking the 10v from the LTC3639 SPW down to 5v.  I had selected this as a cost trade-off in support of very low +5 current consumption if the uC is placed into sleep.  Most low cost small switching power supplies need a min of 5-10mA to remain stable, and in sleep the uC will be in the low uA range.  Perhaps need to consider another switching power supply, but a more costly one as the 125mW loss associated with the LDO is very significant.

How does this look, does it seem like I have missed something?

-al-